Precision hardware etching which commonly used term?
Resist the graphic below the wire etching called lateral erosion of the side wall。 Side width of the lateral extent of corrosion is etched to show. Lateral erosion and etching liquid variety, composition and the use of the etching process and equipment.
Wire thickness (excluding thickness) and the ratio of lateral erosion known as etching coefficient. =V/X etching coefficient using etching coefficient measured lateral erosion of the size of the bump. Etching coefficient, the higher side less erosion. Inprinted circuit board etching operations, hope to have higher etching factor, especially for high density precision printed circuit board of the wires is even more so.Paper cutting
Coating increases width:
When the pattern plating, due to the corrosion resistance of electroplated metal layer thickness beyond plating layer thickness of wire width added and referred to as deposits increase width。 Corrosion resistance of coated wide and electroplate layer thickness and total thickness of plating has a direct relationship。 Practice of production, should be widened to prevent coating.
Corrosion resistance of metal coated wide longitudinal and lateral erosion combined coatings. Widened without coating, coating the longitudinal lateral erosion.
Etching depth of dissolved metals in unit time (often indicated by μg/min) or the time required to dissolve a certain thickness of metal (min). Corrosion of carbon steel cutting dies
Dissolved copper content:
Allow etch rates, etching quantity of dissolved copper. How many grams of copper per liter of dissolved in etching solution (g/l) to show. Etching solution to specific, the dissolved copper can be necessary.
Resist the graphic below the wire etching called lateral erosion of the side wall. Side width of the lateral extent of corrosion is etched to show。 Lateral erosion and etching liquid variety, composition and the use of the etching process and equipment。